At NUFESA Labs, Failure Analysis is a key service we provide to support the reliability of electronic assemblies. In this case study, we present a typical example involving a 12-layer board that failed in the field.
The problem
The first step was to narrow down the issue, which we did in collaboration with the customer. The investigation pointed to one of the BGAs assembled in the circuit as the likely source of the failure.
Initial inspection
We started by inspecting the component using X-ray and tomography. These techniques showed no visible issues with the solder balls or the die. However, the failure persisted, so we continued investigating by tracing the signal paths on the board.
Identifying the root cause
During signal tracing, we identified a suspicious stacked via. Since the X-ray inspection did not reveal any faults in that area, we proceeded with a metallographic cross-section.
Metallographic results
The cross-section clearly showed fractures at several points within the via structure, confirming this as the root cause of the failure.
Conclusion
This case highlights the importance of combining multiple inspection techniques—starting with non-destructive methods and, when necessary, moving to destructive analysis—to uncover hidden failures.
At NUFESA Labs, we offer comprehensive Failure Analysis services to help ensure the integrity and performance of your electronic assemblies.