Mechanical testing
These tests are essential to ensure that electronic products can withstand the physical stresses they may encounter during assembly, transportation, or use. The resistance, flexibility and deformations of electronic components and PCBAs are evaluated under various mechanical conditions.
Strain test
Is a test designed to measure and evaluate the mechanical deformations (strains) experienced by PCBAs when they are subjected to external forces. These deformations can be caused by various factors such as mechanical stresses during assembly, thermal changes, vibrations, etc.
Deformation test (warpage)
It is a test performed to measure and evaluate the curvature or deformation that can occur in PCBAs due to temperature in the reflow process. Warpage is a critical issue in the manufacturing and assembly of electronic devices, as it can affect assembly precision, the reliability of electrical connections, and the structural integrity of the final product.
Tensile Test
Different compression and tensile forces are applied to the PCBA and components to evaluate the flexibility and the force required to break or deform the points of interest. For example:
- Flexion Tests: A known compression force is applied to an area of the PCBA with supports on opposite sides, allowing it to bend until it breaks. This allows us to determine the force required and the displacement of the PCBA at the breaking point.
- Tensile and Compression Tests: Components are subjected to tensile and compression forces to evaluate the mechanical strength of the solder joints.
