Failure analysis
This area of service involves finding defects in PCBAs when you are unable to identify the root cause.
We can analyse the entire assembly to verify where the issues can be arising through variety of different methods, using a combination of visual methods (optical microscopy), ionic contamination (ROSE, IC) or even SEM/EDX.
We are available to provide detailed case studies to identify critical areas including defects and areas with non-defects that could lead to problems in the future to identify areas needing improvement.
